Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding.
This report contains market size and forecasts of Wire Wedge Bonder Equipment in global, including the following market information:
Global Wire Wedge Bonder Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Wire Wedge Bonder Equipment Market Sales, 2017-2022, 2023-2028, (Units)
Global top five Wire Wedge Bonder Equipment companies in 2021 (%)
The global Wire Wedge Bonder Equipment market was valued at 79 million in 2021 and is projected to reach US$ 96.6 million by 2028, at a CAGR of 2.9% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Fully Automatic Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wire Wedge Bonder Equipment include Kulicke and Soffa, ASM Pacific Technology (ASMPT), Hesse, Cho-Onpa, FandK Delvotec Bondtechnik, Palomar Technologies, DIAS Automation, West-Bond and Hybond and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Wire Wedge Bonder Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wire Wedge Bonder Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Wire Wedge Bonder Equipment Market Segment Percentages, by Type, 2021 (%)
Fully Automatic
Semi-automatic
Manual
Global Wire Wedge Bonder Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Wire Wedge Bonder Equipment Market Segment Percentages, by Application, 2021 (%)
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
Global Wire Wedge Bonder Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Units)
Global Wire Wedge Bonder Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wire Wedge Bonder Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Wire Wedge Bonder Equipment revenues share in global market, 2021 (%)
Key companies Wire Wedge Bonder Equipment sales in global market, 2017-2022 (Estimated), (Units)
Key companies Wire Wedge Bonder Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Kulicke and Soffa
ASM Pacific Technology (ASMPT)
Hesse
Cho-Onpa
FandK Delvotec Bondtechnik
Palomar Technologies
DIAS Automation
West-Bond
Hybond
TPT