Wire bonder is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of chip packaging. The thin-wire is used to make these connections that are generally made of gold, copper, aluminum or silver.

Market Analysis and Insights: Global Wire Bonders Market
The global Wire Bonders market was valued at US$ XX in 2020 and will reach US$ XX million by the end of 2027, growing at a CAGR of XX% during 2022-2027.

Global Wire Bonders Scope and Market Size
The global Wire Bonders market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Wire Bonders market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

Segment by Type
Manual Wire Bonders
Semi-Automatic Wire Bonders
Fully-Automatic Wire Bonders

Segment by Application
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

The Wire Bonders market is analysed and market size information is provided by regions (countries). Segment by Application, the Wire Bonders market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

By Company
Kulicke & Soffa (K&S)
ASM Pacific Technology
TPT
Hesse Mechatronics
West•Bond
Hybond
Shibuya
Questar Products
Anza Technology
F&K Delvotec Bondtechnik
Shinkawa
Palomar Technologies
Micro Point Pro Ltd (MPP)
Planar Corporation
Mech-El Industries Inc.
Ultrasonic Engineering
DIAS Automation