Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.
In the recent years, wafer-level packaging equipment production value showed a trend of steady growth. At present, the major manufacturers of wafer-level packaging equipment are concentrated in North America, EU, and Japan. Applied Materials is the world's largest wafer-level packaging equipment producer.

Market Analysis and Insights: Global Wafer-level Packaging Equipment Market
The global Wafer-level Packaging Equipment market is valued at US$ 2418.4 million in 2019. The market size will reach US$ 4508.2 million by the end of 2026, growing at a CAGR of 9.2% during 2021-2026.

Global Wafer-level Packaging Equipment Scope and Segment
Wafer-level Packaging Equipment market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Wafer-level Packaging Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2016-2027.

Segment by Type
Fan In
Fan Out

Segment by Application
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other

By Company
Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Disco
SEMES
Suss Microtec
Veeco/CNT
Rudolph Technologies

Production by Region
North America
Europe
China
Japan

Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E