Io-Link Master
Io-Link Master market is segmented by Type, and by Application. Players, stakeholders, and other ... Read More
Test and Burn-in Sockets market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Test and Burn-in Sockets market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2016-2027.
Segment by Type
Burn-in Socket
Test Socket
Test socket had a market share of 62.89% in 2019, followed by burn-in socket.
Segment by Application
Memory
CMOS Image Sensor
High Voltage
RF
SOC, CPU, GPU, etc.
Other non-memory
SOC, CPU, GPU, etc. is the greatest segment of test and burn-in sockets application, with a share of 26.1% in 2019.
By Company
Yamaichi Electronics
Cohu
Enplas
ISC
Smiths Interconnect
LEENO
Sensata Technologies
Johnstech
Yokowo
WinWay Technology
Loranger
Plastronics
OKins Electronics
Ironwood Electronics
3M
M Specialties
Aries Electronics
Emulation Technology
Qualmax
Micronics
Essai
Rika Denshi
Robson Technologies
Translarity
Test Tooling
Exatron
Gold Technologies
JF Technology
Advanced
Ardent Concepts
Production by Region
North America
Europe
Taiwan (China)
Japan
South Korea
Southeast Asia
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
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