There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.
This report contains market size and forecasts of Test & Burn-in Socket in global, including the following market information:
Global Test & Burn-in Socket Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Test & Burn-in Socket Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Test & Burn-in Socket companies in 2021 (%)
The global Test & Burn-in Socket market was valued at 1268 million in 2021 and is projected to reach US$ 2066.3 million by 2028, at a CAGR of 7.2% during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Burn-in Socket Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Test & Burn-in Socket include Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconnect, LEENO, Sensata Technologies, Johnstech and Yokowo, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Test & Burn-in Socket manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Test & Burn-in Socket Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Test & Burn-in Socket Market Segment Percentages, by Type, 2021 (%)
Burn-in Socket
Test Socket
Global Test & Burn-in Socket Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Test & Burn-in Socket Market Segment Percentages, by Application, 2021 (%)
Memory
CMOS Image Sensor
High Voltage
RF
SOC, CPU, GPU, etc.
Other Non-Memory
Global Test & Burn-in Socket Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Test & Burn-in Socket Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Test & Burn-in Socket revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Test & Burn-in Socket revenues share in global market, 2021 (%)
Key companies Test & Burn-in Socket sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Test & Burn-in Socket sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Yamaichi Electronics
Cohu
Enplas
ISC
Smiths Interconnect
LEENO
Sensata Technologies
Johnstech
Yokowo
WinWay Technology
Loranger
Plastronics
OKins Electronics
Ironwood Electronics
3M
M Specialties
Aries Electronics
Emulation Technology
Qualmax
MJC
Essai
Rika Denshi
Robson Technologies
Translarity
Test Tooling
Exatron
Gold Technologies
JF Technology
Advanced
Ardent Concepts