SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.
The emergence of advanced and compact consumer electronic devices as one of the primary growth factors for this semiconductor packaging market. The consumer electronics devices industry has witnessed a massive transformation in the recent years, where feature phones were replaced by smartphones and personal computers by laptops and tablets. Furthermore, the adoption of the smart homes concept, where electronic devices can be monitored and controlled with the help of mobile applications, will further transition this industry. This will induce electronic device manufacturers to constantly upgrade their products in terms of several factors such as design, processing power, power consumption, and user-interface, that will require the use of robust technology and develop compact devices. This demand for compact electronic devices will compel semiconductor manufacturers to develop denser ICs with increased circuitry, which will boost the demand for advanced IC packagingtechniques such as SiP.

Market Analysis and Insights: Global System-in-Package Market
The global System-in-Package market size is projected to reach US$ 78420 million by 2027, from US$ 52900 million in 2020, at a CAGR of 5.3% during 2021-2027.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global System-in-Package market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global System-in-Package market in terms of revenue.
On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global System-in-Package market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global System-in-Package market.

Global System-in-Package Scope and Market Size
System-in-Package market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global System-in-Package market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.

Segment by Type
2D IC
2.5D IC
3D IC

Segment by Application
Consumer Electronics
Communications
Automotive & Transportation
Aerospace & Defense
Healthcare
Others

By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Nordic
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

By Company
Amkor Technology
ASE
Jiangsu Changjiang Electronics Technology (JCET)
Siliconware Precision Industries (SPIL)
United Test and Assembly Center (UTAC)