Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevent wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting.
This report contains market size and forecasts of Semiconductor Back Grinding Tapes in global, including the following market information:
Global Semiconductor Back Grinding Tapes Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Semiconductor Back Grinding Tapes Market Sales, 2017-2022, 2023-2028, (K Sqm)
Global top five Semiconductor Back Grinding Tapes companies in 2021 (%)
The global Semiconductor Back Grinding Tapes market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
UV Curable Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Back Grinding Tapes include Mitsui Chemicals Tohcello, Lintec, Denka, Nitto, Furukawa Electric, D&X, AI Technology, Taicang Zhanxin and Plusco Tech, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Semiconductor Back Grinding Tapes manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Back Grinding Tapes Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Semiconductor Back Grinding Tapes Market Segment Percentages, by Type, 2021 (%)
UV Curable
Non-UV Curable
Global Semiconductor Back Grinding Tapes Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Semiconductor Back Grinding Tapes Market Segment Percentages, by Application, 2021 (%)
6 Inch
8 Inch
12 Inch
Others
Global Semiconductor Back Grinding Tapes Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Semiconductor Back Grinding Tapes Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Back Grinding Tapes revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Semiconductor Back Grinding Tapes revenues share in global market, 2021 (%)
Key companies Semiconductor Back Grinding Tapes sales in global market, 2017-2022 (Estimated), (K Sqm)
Key companies Semiconductor Back Grinding Tapes sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Mitsui Chemicals Tohcello
Lintec
Denka
Nitto
Furukawa Electric
D&X
AI Technology
Taicang Zhanxin
Plusco Tech
Shanghai Guku
Boyan
BYE