TO packages consist of a TO header and a TO cap. While the TO header forms the basis of the encapsulated components and provides them with power, the cap enables smooth optical signal transmission. These two components form a hermetically sealed package that protects sensitive semiconductor components. Key types are TO-5, TO-3, TO-8, TO-46, TO-66, TO-254, TO-256, TO-257, TO-258, etc.
This report contains market size and forecasts of Power Transistor Outline (TO) Packages in global, including the following market information:
Global Power Transistor Outline (TO) Packages Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Power Transistor Outline (TO) Packages Market Sales, 2017-2022, 2023-2028, (Million Units)
Global top five Power Transistor Outline (TO) Packages companies in 2021 (%)
The global Power Transistor Outline (TO) Packages market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
One-piece Construction Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Power Transistor Outline (TO) Packages include Kyocera, NGK/NTK, Egide, NEO Tech, AdTech Ceramics, Ametek, SCHOTT, Electronic Products, Inc. (EPI) and Complete Hermetics, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Power Transistor Outline (TO) Packages manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Power Transistor Outline (TO) Packages Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Million Units)
Global Power Transistor Outline (TO) Packages Market Segment Percentages, by Type, 2021 (%)
One-piece Construction
Two-piece Construction
Global Power Transistor Outline (TO) Packages Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Million Units)
Global Power Transistor Outline (TO) Packages Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Computing & Communication
Industrial
Automotive Electronics
Aerospace and Military
Others
Global Power Transistor Outline (TO) Packages Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Million Units)
Global Power Transistor Outline (TO) Packages Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Power Transistor Outline (TO) Packages revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Power Transistor Outline (TO) Packages revenues share in global market, 2021 (%)
Key companies Power Transistor Outline (TO) Packages sales in global market, 2017-2022 (Estimated), (Million Units)
Key companies Power Transistor Outline (TO) Packages sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Kyocera
NGK/NTK
Egide
NEO Tech
AdTech Ceramics
Ametek
SCHOTT
Electronic Products, Inc. (EPI)
Complete Hermetics
Q-Tech
TE Connectivity
Hermetic Solutions Group (Sinclair）
Koto Electric
Materion
Electronic Products, Inc. (EPI)
Complete Hermetics
SGA Technologies
Amphenol Aerospace
Radiall
Glenair
Winchester Tekna
Rosenberger
Teledyne Technologies
Souriau
Dietze Group
SHINKO ELECTRIC