This report contains market size and forecasts of Memory Package Substrate in global, including the following market information:
Global Memory Package Substrate Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Memory Package Substrate Market Sales, 2017-2022, 2023-2028, (K Sqm)
Global top five Memory Package Substrate companies in 2021 (%)
The global Memory Package Substrate market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
WB BGA Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Memory Package Substrate include Samsung Electro-Mechanics, Simmtech, Daeduck, Korea Circuit, Ibiden, Kyocera, ASE Group, Shinko and Fujitsu Global, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Memory Package Substrate manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Memory Package Substrate Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Memory Package Substrate Market Segment Percentages, by Type, 2021 (%)
WB BGA
FC BGA
3D IC
WL CSP
Global Memory Package Substrate Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Memory Package Substrate Market Segment Percentages, by Application, 2021 (%)
Non-volatile Memory
Volatile MEmory
Global Memory Package Substrate Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Sqm)
Global Memory Package Substrate Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Memory Package Substrate revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Memory Package Substrate revenues share in global market, 2021 (%)
Key companies Memory Package Substrate sales in global market, 2017-2022 (Estimated), (K Sqm)
Key companies Memory Package Substrate sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Samsung Electro-Mechanics
Simmtech
Daeduck
Korea Circuit
Ibiden
Kyocera
ASE Group
Shinko
Fujitsu Global
Doosan Electronic
Toppan Printing
Unimicron
Kinsus
Nanya