As the global economy mends, the 2021 growth of Semiconductor Packaging and Assembly Equipment will have significant change from previous year. According to our (LP Information) latest study, the global Semiconductor Packaging and Assembly Equipment market size is USD million in 2022 from USD 2695.5 million in 2021, with a change of % between 2021 and 2022. The global Semiconductor Packaging and Assembly Equipment market size will reach USD 4057.6 million in 2028, growing at a CAGR of 6.0% over the analysis period.
The United States Semiconductor Packaging and Assembly Equipment market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global Semiconductor Packaging and Assembly Equipment market, reaching US$ million by the year 2028. As for the Europe Semiconductor Packaging and Assembly Equipment landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main Semiconductor Packaging and Assembly Equipment players cover Applied Materials, ASMPT, DISCO Corporation, and EV Group, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Packaging and Assembly Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022, in Section 2.3; and forecast to 2028 in section 12.6
Die- Level Packaging and Assembly Equipment
Wafer-Level Packaging and Assembly Equipment
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 12.7.
IDM(Integrated Device Manufacturers)
OSAT(Outsourced Semiconductor Assembly and Test Companies)
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the prominent manufacturers in this market, include
Applied Materials
ASMPT
DISCO Corporation
EV Group
Kulicke and Soffa Industries
TEL
Tokyo Seimitsu
Rudolph Technologies
SEMES
Suss Microtec
Veeco/CNT
Ulvac Technologies