As the global economy mends, the 2021 growth of Semiconductor Package will have significant change from previous year. According to our (LP Information) latest study, the global Semiconductor Package market size is USD million in 2022 from USD 28040 million in 2021, with a change of % between 2021 and 2022. The global Semiconductor Package market size will reach USD 42150 million in 2028, growing at a CAGR of 6.0% over the analysis period.
The United States Semiconductor Package market is expected at value of US$ million in 2021 and grow at approximately % CAGR during review period. China constitutes a % market for the global Semiconductor Package market, reaching US$ million by the year 2028. As for the Europe Semiconductor Package landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 5-year period.
Global main Semiconductor Package players cover SPIL, ASE, Amkor, and JCET, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Package market by product type, application, key players and key regions and countries.
Segmentation by type: breakdown data from 2017 to 2022 in Section 2.3; and forecast to 2028 in section 10.7.
Flip Chip
Embedded Die
Fan-in Wafer Level Packaging (Fi Wlp)
Fan-out Wafer Level Packaging
Others
Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 10.8.
Consumer Electronics
Automotive Industry
Aerospace and Defense
Medical Devices
Communications and Telecom
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report: Breakdown data in in Chapter 3.
SPIL
ASE
Amkor
JCET
TFME
Siliconware Precision Industries
Powertech Technology Inc
TSMC
Nepes
Walton Advanced Engineering
Unisem
Huatian
Chipbond
UTAC
Chipmos
China Wafer Level CSP
Lingsen Precision
Tianshui Huatian Technology Co., Ltd
King Yuan Electronics CO., Ltd.
Formosa
Carsem
J-Devices
Stats Chippac
Advanced Micro Devices