This report contains market size and forecasts of Flip-Chip Package Substrate in global, including the following market information:
Global Flip-Chip Package Substrate Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Flip-Chip Package Substrate Market Sales, 2017-2022, 2023-2028, (Sqm)
Global top five Flip-Chip Package Substrate companies in 2021 (%)
The global Flip-Chip Package Substrate market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
FCBGA Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Flip-Chip Package Substrate include Unimicron, Ibiden, Nan Ya PCB, Shiko Electric Industries, AT&S, Kinsus Interconnect Technology, Semco, Kyocera and TOPPAN, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Flip-Chip Package Substrate manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Flip-Chip Package Substrate Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Sqm)
Global Flip-Chip Package Substrate Market Segment Percentages, by Type, 2021 (%)
FCBGA
FCCSP
Global Flip-Chip Package Substrate Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Sqm)
Global Flip-Chip Package Substrate Market Segment Percentages, by Application, 2021 (%)
High-end servers
GPU
CPU and MPU
ASIC
FPGA
Global Flip-Chip Package Substrate Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Sqm)
Global Flip-Chip Package Substrate Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Flip-Chip Package Substrate revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Flip-Chip Package Substrate revenues share in global market, 2021 (%)
Key companies Flip-Chip Package Substrate sales in global market, 2017-2022 (Estimated), (Sqm)
Key companies Flip-Chip Package Substrate sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Unimicron
Ibiden
Nan Ya PCB
Shiko Electric Industries
AT&S
Kinsus Interconnect Technology
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
ACCESS