This report studies the Electronic Packaging Materials market.

Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.

Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
The leading manufacturers of electronic packaging materials include Sumitomo Chemical, Shinko Electric Industries, Toppan, Tanaka, Mitsui High-Tec and others, with the top three accounting for about 25% of the market.
China is the main market, accounting for about 40%, followed by the United States, accounting for about 15%.

Market Analysis and Insights: Global Electronic Packaging Materials Market
In 2020, the global Electronic Packaging Materials market size was US$ 5335.4 million and it is expected to reach US$ 6473.1 million by the end of 2027, with a CAGR of 2.8% during 2021-2027.
Global Electronic Packaging Materials Scope and Market Size
Electronic Packaging Materials market is segmented by region, by country, company, type, application and by sales channels. Players, stakeholders, and other participants in the global Electronic Packaging Materials market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region, by country, company, type, application and by sales channels for the period 2016-2027.

Segment by Type, the Electronic Packaging Materials market is segmented into
Metal Packages
Plastic Packages
Ceramic Packages

Segment by Application, the Electronic Packaging Materials market is segmented into
Semiconductor & IC
PCB
Others

Regional and Country-level Analysis:
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Southeast Asia
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

Competitive Landscape and Electronic Packaging Materials Market Share Analysis
Electronic Packaging Materials market competitive landscape provides details and data information by companies. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2016-2021. It also offers detailed analysis supported by reliable statistics on sale and revenue by players for the period 2016-2021. Details included are company description, major business, Electronic Packaging Materials product introduction, recent developments, Electronic Packaging Materials sales by region, type, application and by sales channel.

The major companies include:
DuPont
Evonik
EPM
Mitsubishi Chemical
Sumitomo Chemical
Mitsui High-tec
Tanaka
Shinko Electric Industries
Panasonic
Hitachi Chemical
Kyocera Chemical
Gore
BASF
Henkel
AMETEK Electronic
Toray
Maruwa
Leatec Fine Ceramics
NCI
Chaozhou Three-Circle
Nippon Micrometal
Toppan
Dai Nippon Printing
Possehl
Ningbo Kangqiang