HTCC Substrate means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic with a metal pattern such as tungsten or molybdenum which as a high melting point property. Generally, the fired temperature of HTCC substrate is 1500 to 1600 C. HTCC substrate provides the properties of high strength, good heat dissipation, high reliability. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
This report studies HTCC Ceramic Shell/Housings, and HTCC SMD Ceramic Packages.
This report contains market size and forecasts of Ceramic to Metal Package & Shell in global, including the following market information:
Global Ceramic to Metal Package & Shell Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Ceramic to Metal Package & Shell Market Sales, 2017-2022, 2023-2028, (Million Units)
Global top five Ceramic to Metal Package & Shell companies in 2021 (%)
The global Ceramic to Metal Package & Shell market was valued at 2247.2 million in 2021 and is projected to reach US$ 3605.3 million by 2028, at a CAGR of 7.0% during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
HTCC Ceramic Shell/Housings Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Ceramic to Metal Package & Shell include Kyocera, NGK/NTK, Egide, NEO Tech, AdTech Ceramics, Ametek, Electronic Products, Inc. (EPI), CETC 43 (Shengda Electronics) and Jiangsu Yixing Electronics, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Ceramic to Metal Package & Shell manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Ceramic to Metal Package & Shell Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Million Units)
Global Ceramic to Metal Package & Shell Market Segment Percentages, by Type, 2021 (%)
HTCC Ceramic Shell/Housings
HTCC Ceramic PKG
Global Ceramic to Metal Package & Shell Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Million Units)
Global Ceramic to Metal Package & Shell Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Communication Package
Industrial
Automotive Electronics
Aerospace and Military
Others
Global Ceramic to Metal Package & Shell Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Million Units)
Global Ceramic to Metal Package & Shell Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Ceramic to Metal Package & Shell revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Ceramic to Metal Package & Shell revenues share in global market, 2021 (%)
Key companies Ceramic to Metal Package & Shell sales in global market, 2017-2022 (Estimated), (Million Units)
Key companies Ceramic to Metal Package & Shell sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Kyocera
NGK/NTK
Egide
NEO Tech
AdTech Ceramics
Ametek
Electronic Products, Inc. (EPI)
CETC 43 (Shengda Electronics)
Jiangsu Yixing Electronics
Chaozhou Three-Circle (Group)
Hebei Sinopack Electronic Tech & CETC 13
Beijing BDStar Navigation (Glead)
Fujian Minhang Electronics
RF Materials (METALLIFE)
CETC 55
Qingdao Kerry Electronics
Hebei Dingci Electronic
Shanghai Xintao Weixing Materials