3D TSV or silicon through-hole technology is one of the important technologies used in the semiconductor industry.A silicon through-hole is an electrical connection that passes vertically through a stack of silicon wafers or chips.3D TSV replaces 2D packaging techniques such as lead bonding and flip chip.It is widely used to improve non-memory and CMOS logic functions and memory in electronic devices such as tablets, smartphones and televisions.TSV is an enhanced performance interconnection, made of a columnar structure of silicon, copper, tungsten or polysilicon, that can be electrically interlinked via silicon chips or wafers.In the 2.5d structure, the bare sheet is not assembled on the bare sheet.
This report contains market size and forecasts of 3D TSV and 2.5D in Global, including the following market information:
Global 3D TSV and 2.5D Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global 3D TSV and 2.5D market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Memory Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of 3D TSV and 2.5D include Toshiba, Taiwan Semiconductor, Samsung Electronics, Pure Storage, ASE Group, Amkor Technology, United Microelectronics, STMicroelectronics and Broadcom, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the 3D TSV and 2.5D companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 3D TSV and 2.5D Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global 3D TSV and 2.5D Market Segment Percentages, by Type, 2021 (%)
Memory
MEMS
CMOS Image Sensors
Imaging and Optoelectronics
Advanced LED Packaging
Others
Global 3D TSV and 2.5D Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global 3D TSV and 2.5D Market Segment Percentages, by Application, 2021 (%)
Consumer Electronics
Information and Communication Technology
Automotive
Military
Aerospace and Defense
Other
Global 3D TSV and 2.5D Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global 3D TSV and 2.5D Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies 3D TSV and 2.5D revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies 3D TSV and 2.5D revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Toshiba
Taiwan Semiconductor
Samsung Electronics
Pure Storage
ASE Group
Amkor Technology
United Microelectronics
STMicroelectronics
Broadcom
Intel Corporation
Jiangsu Changing Electronics Technology