Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board (PCB) manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of solder paste inspection (SPI), you can reduce the defects related to soldering by a considerable amount.

Market Analysis and Insights: Global 3D Solder Paste Inspection (SPI) System Market
The global 3D Solder Paste Inspection (SPI) System market was valued at US$ XX in 2020 and will reach US$ XX million by the end of 2027, growing at a CAGR of XX% during 2022-2027.

Global 3D Solder Paste Inspection (SPI) System Scope and Market Size
The global 3D Solder Paste Inspection (SPI) System market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global 3D Solder Paste Inspection (SPI) System market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

Segment by Type
Off-line SPI System
In-line SPI System

Segment by Application
Automotive Electronics
Consumer Electronics
Industrials
Others

The 3D Solder Paste Inspection (SPI) System market is analysed and market size information is provided by regions (countries). Segment by Application, the 3D Solder Paste Inspection (SPI) System market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

By Company
Koh Young
CyberOptics Corporation
Test Research, Inc (TRI)
MirTec Ltd
PARMI Corp
Viscom AG
ViTrox
Vi TECHNOLOGY
Mek (Marantz Electronics)
Pemtron
SAKI Corporation
Nordson YESTECH
Omron Corporation
Goepel Electronic
Machine Vision Products (MVP)
Caltex Scientific
ASC International
Sinic-Tek Vision Technology
Shenzhen JT Automation Equipment
Jet Technology