3D IC & 2.5D IC Packaging market is segmented by region (country), players, by Type and by Application. Players, stakeholders, and other participants in the global 3D IC & 2.5D IC Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
For United States market, this report focuses on the 3D IC & 2.5D IC Packaging market size by players, by Type and by Application, for the period 2017-2028. The key players include the global and local players, which play important roles in United States.
Segment by Type
3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
Segment by Application
Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
By Company
Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering